This is an example page from the Netpack content management system from the NetPack Case Study at heyotwell.com.

Choose Category Keywords for this Product

Choose any of the keywords below to help categorize your product.

Note: select only the keywords which help describe your product or service. Choosing more keywords will not
necessarily make your product appear more frequently in search results.

When choosing keywords, consider: is your product compatible with the technology or process listed? Is your product a component of a technology or chip package type? Is your product or service used during a specific stage in the manufacturing process?

Interconnect Technologies
  Chip Embedding Technology Anisotropic Conductive Adhesive Joining
  Bumpless Build up Layer Non Conductive Adhesive Joining
  Chip in Polymer Flip Chip by Thermocompression
  Chip in Paper Tape Automated Bonding Technology
  Chip in Textile Surface Mount Technology
  Flip Chip Technology Soldering
  Direct Chip Attatch Adhesive Joining
  Flip Chip Soldering Wire Bonding Technology
  Flip Chip by Adhesive Joining Chip on Board
  Isotropic Conductive Adhesive Joining  

 

Processes
  Bumping Process Flip Chip Reflow
  Controlled Collapse Chip Connection Flip Chip Underfilling
  Under Bump Metallization Hybrid Process
  Bumping by Electroplating Surface Mount Process
  Bumping by Stencil Printing Solder Paste Printing
  Mechanical Stud Bumping Component Placement
  Chip On Board Process Reflow Soldering
  Die Bonding Cleaning
  Wire Bonding Rework
  Glob Top Dispensing Wafer Level Process
  Molding Anodic Bonding
  Encapsulation Process Lithography
  Glob Top Encapsulation Sputtering
  Transfer Molding Etching
  Underfilling Thinning
  Flip Chip Process Sawing
  Flip Chip Placement Electroplating
    Printing

 

Chip Package Types
  Area Array Packages Plastic Quad Flat Packages
  Chip Scale Packages Shrink Small Outline Packages
  Chip Size Packages Small Outline Packages
  Wafer Level Chip Size Packages Thin Quad Flat Packages
  Ball Grid Arrays Thin Small Outline Packages
  Ceramic Ball Grid Arrays Through Hole Leaded Packages
  Plastic Ball Grid Arrays Plastic Dual In Line
  Fine Pitch Ball Grid Arrays Ceramic Dual In Line
  Lead Frame Surface Mount Devices Ceramic Pin Grid Array
  Plastic Leaded Chip Carriers Organic Pin Grid Array

 

In the last step, you can confirm the information you entered.