This is an example page from the Netpack content management system from the NetPack Case Study at heyotwell.com.

netpack - the network for microelectronic packaging
Packaging Store Vision Lab Netpack Club Education Pool About Netpack
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 Applications:
 MEMS (80) - Single Chip Packages (15) - Multi Chip Modules(2) - System in Packages(9)

 Services:
 Assembly Services(34) - Research and Development Services(90) - Design Services(12) - Wafer Bumping Services(4) - Chip Packaging Services(9)

 Process:
 Bumping Process(10) - Chip On Board Process(14) - Encapsulation Process(23) - Flip Chip Process(100) - Surface Mount Process(2) - Wafer Level Process(25)
  
Your last 5 searches
 
 Heatsink pentium 500
Heatsink manufacturers
Heatsink installation guide
Flip-chip diagram
Flip-chip
  
Search result for "Heatsink Pentium 500"
Category: Stencil Type Material Thickness Min. Aperture
Product Name
Company Name		 Electroformed Stainless Steel 300-500 µm 200 µm
AGT7366
Supplier: Name		 Laser Cut, Electrocut Nickel, Polymer 100-300 µm 150 µm
T1 - 873
Company Name		 Laser Cut Nickel-Plated Brass 155-158 µm 187 µm
Category: Solder Balls Alloy Size
Product Name
Company Name		 Au-Sn 10-30 µm
Sol 33
Supplier		 Au-Sn, Sn-Cu, Sn-Ag-Cu, Pb-Sn, Other 10-30 µm
Sol 55
Supplier		 Sn-Ag-Cu 15-55 µm
Category: Reflow ovens Type Max. Temp. Nitrogen Option
Product Name
Company Name		 IR 1300 °C yes
Product Name
Company Name		 Full Convection 1200 °C yes